| 摘要 |
PURPOSE:To improve a radiation detecting element. CONSTITUTION:A plurality of recess parts are formed on the upper surface side of a substrate. A photodetector array is formed by depositing a semiconductor thin film on the rear surface of the substrate and has a plurality of photoelectric converting parts. Scintillators 43 are embedded in a plurality of recess parts. A solid-state image pickup element array is provided by the deposition of the semiconductor thin film 31 on the rear surface, wherein the scintillators 43 are embedded. Therefore, the position deviation caused by sticking and loss of light caused by bonding agent can be intrinsically overcome. The scintillation light can be effectively cast at the photoelectric converting part by providing a reflecting film 44. The incident efficiency of radiation can be enhanced by thinning the side wall of each recess part at the upper surface side.
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