| 摘要 |
<p>PURPOSE:To provide a semiconductor device having a larger number of pins with a finer pitch by improving the packaging density thereof. CONSTITUTION:The surface of a semiconductor chip 1b is covered with a heat- resisting insulating film 13b for chip coat. The film 13b is provided thereon with a wiring pattern 12b which is composed of such metal as copper plated with gold. One ends of the wiring pattern 12b are extended beyond the circumference and connected to aluminum electrode pads 15b on the semiconductor chip; the other end are provided with metal projected electrodes 14b. This facilitates highly accurate mounting and improves the packaging density.</p> |
