| 摘要 |
<p>PURPOSE:To perform a high-accuracy alignment operation by a method wherein the dislocation of a substrate is detected by using a video signal, for alignment use, which is clear without containing any speckle. CONSTITUTION:An alignment mark on a wafer is reflected by a beam of pulsed light, for alignment use, which exposed the wafer 5 and which is emitted from an irradiation system 1; a beam of reflected light is made incident on a CCD camera 9 by using a mirror 8; the dislocation of the wafer 5 is detected by using an obtained video signal; a stage drive system is driven; and the wafer 3 is aligned. The exposure time of the CCD camera 9 is set to be sufficiently long so as to eliminate the speckle of the video signal. When the light quantity for the video signal is insufficient, the exposure time is set to be longer. When the light quantity is excessive, the light-emitting quantity of a light source for the beam of pulsed light for alignment use is reduced.</p> |
