| 摘要 |
PURPOSE:To facilitate the analysis of the cause for a defect by building a circuit for inspection having a function for inspection into the device and providing a bonding pad for 10 order to make valid the function for inspection of the circuit for inspection. CONSTITUTION:This semiconductor memory device 1 is provided with the circuit 1a for inspection which inspects a change of data by the influence of adjacent bit lines, a signal line 1b and the bonding pad 1c for test. A tester 2 connected to the device via a prober, etc., inputs prescribed set addresses and data, etc., to the device 1. The non-defective device or the defective device is decided from the output result thereof. The device 1 decided to be defective is subjected again to the inspection as to whether the device is defective or non-defective with the tester 2 by impressing a voltage the pad 1c and executing alteration by each bit by the circuit 1a. As a result, the cause for the defect is easily analyzed without changing the set data, etc., of the tester 2. The labor and time are thus saved and the error by a change of the data, etc., is prevented. |
