| 摘要 |
PURPOSE:To straighten a lead, which is bent up and down or right and left, promptly with accuracy, by adjusting each lead up and down or right and left according to the amount of deformation after each amount of up, down, right and left bend deformation of the lead is detected. CONSTITUTION:A memory 2 comprises a ROM storing program for carrying out operation according to a procedure, and a RAM storing lead specifications for semiconductor devices. A lead inspecting part 3 detects each amount of up, down, right and left bend deformation of the leads that are elongated from the side of the IC package, and compares it with each specified value in the memory 2 so as to generate a signal corresponding to the amount of deformation. In a lead adjusting part 4, the lead is adjusted up and down or right and left on the basis of each amount of bend deformation detected in the lead by the lead inspecting part 3. Consequently, adjusting each lead up and down or right and left can be carried out at the same time, and operational efficiency can be improved. |
