发明名称 MANUFACTURE OF DOPING REGION IN SUBSTRATE
摘要 PURPOSE: To provide a method for producing a dope area in an integrated circuit board so as to satisfactorily control the distribution of dopant even when the penetration depth of dopant is a little and its gradient is sharp. CONSTITUTION: An intermediate layer 12 is prepared on a substrate 11 composed of a semiconductor material, a doped glass layer 13 is prepared on the intermediate layer 12, a dope area 14 is formed during a heating process by diffusing the dopant from the doped glass layer 13 through the intermediate layer 12 into the substrate 11, and the intermediate layer 12 is formed from a material to be functioned as a diffusion barrier for the dopant so that the intermediate layer can limit the concentration of dopant in the dope area 14.
申请公布号 JPH05190481(A) 申请公布日期 1993.07.30
申请号 JP19920184548 申请日期 1992.06.17
申请人 SIEMENS AG 发明人 KAARU EHINGAA;MIHIAERU BIANKO;HERUMUUTO KUROOZE
分类号 H01L21/225;H01L21/331;H01L29/73;H01L29/732 主分类号 H01L21/225
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