| 摘要 |
PURPOSE:To increase the degree of freedoms of connecting bonding pads of corners of an LSI chip to leads. CONSTITUTION:A layout block 1 in which interface buffers 28a adjacent to corner blocks 16 are connected to bonding pads 19, 20 provided at the blocks 16 via pad lead wirings 26 is provided thereby to use parts of bonding pads for connecting a power source, GND of the block 16 as bonding pads for connecting signal lines, thereby increasing the degree of freedoms of connecting them to the leads. |
