| 摘要 |
<p>PURPOSE:To obtain the photosensitive resin compsn. for forming circuit patterns of an aq. alkaline soln. peeling type without having undercuts and without requiring a surface roughening treatment after peeling and removing of an etching resist film. CONSTITUTION:This compsn. is constituted by compounding a nonfunctional resin at 10 to 200 parts with 100 parts UV curing type etching resist ink consisting of a high acid value polymer having at least >=2 pieces of carboxylic acid group in one molecule, a photopolymerizable monomer having at least one piece of carboxylic (meth)acryloyl groups (signifying an acryloyl group and a methacryloyl group) and at least one piece of carboxylic acid groups in one molecule and a photopolymerizable monomer.</p> |
