ELECTRONIC COMPONENT MOUNTING METHOD AND DEVICE

摘要

PURPOSE:To enable the leads of an electronic component to be inserted into lead inserting holes provided to a board, then tentatively fixed without clinching, and soldered. CONSTITUTION:A first process where solder flux bumps 3 are formed around a lead inserting hole 5 where the leads 7 of an electronic component 6 formed on a board 4 are inserted, a second process where the leads 7 of the component 6 are inserted into the hole 5, and a third process where the side of the board from which the leads 7 are projected out from the board 4 is brought into contact with molten solder to solder the leads 7 to the wiring of the board 4.