| 摘要 |
PURPOSE:To improve reliability and reduce the production cost of a semiconductor device with a multilevel lead frame. CONSTITUTION:A semiconductor device comprises a stage 22 for mounting a semiconductor chip 21, a plurality of electrode members 23 and 24 connected by wire bonding to the semiconductor chip 21, a lead 26 connected by wire bonding to the electrode members 23 and 24 or to a semiconductor chip 21, a resin package 27 for packing the semiconductor chip 21, the stage 22, the electrode members 23 and 24, and part of the lead 26. The stage 22 and the electrode member 23 are located away from each other, and the electrodes 23 and 24 are also located away from each other so that these spaces are filled with the resin of the resin package 27. |
