| 摘要 |
PURPOSE:To provide a guard ring which can reduce time for a manufacturing process and can be formed in a short time at a low cost. CONSTITUTION:In place of a conventional guard ring by means of thermal diffusion, a guard ring is obtained, comprising a groove 12 formed on a semiconductor substrate by means of etching, etc., and a conductor 202 formed inside the groove in contact with an insulation film 44 provided on an inner face of the groove 12 while a second conductivity type region which is formed on a surface of the semiconductor substrate and is in contact with the groove 12 as well as conducting with the conductor 202 is provided. Thus long time and a cost which have been required for thermal diffusion in order to obtain the conventional guard ring having a large radius of curvature can largely be reduced. |
