| 摘要 |
PURPOSE:To eliminate the generation of a void in a rigid flex wiring board and to lessen the irregularities of the board thickness of the wiring board when the rigid flex wiring board is manufactured by means of a press for forming a multilayer structure. CONSTITUTION:A cushioning material formed by arranging a prepreg 3 between two sheets of thermoplastic resin films 2 and 2 is superposed on a constituent body formed by superposing a rigid printed-wiring board 4 on a flexible printed wiring-board 6 via a prepreg 5 for adhesion use and is heated and pressed. As a recess 7 is filled with the resin of the prepreg in the cushioning material and the resin is hardened, a pressure is uniformly transmitted to the whole of a rigid flex wiring board. |
