Acceleration sensor assembly - contains operational amplifier and acceleration sensor on ceramic plate and connected to circuit via equal dia. bonding wires.

摘要

The arrangement contains a circuit on a ceramic plate (3) attached to a base plate (1). An operational amplifier (4) in the form of a silicon chip is mounted on the ceramic plate. An acceleration sensor (20) on the ceramic plate consists of a piezoresistive semiconducting material. The amplifier and circuits are connected by a first group of bonding wires. The acceleration sensor is connected to the circuits via a second group of bonding wires of the same dia. as the first group. USE/ADVANTAGE - Esp. for use with motor vehicle air bag systems. The arrangement eliminates the high production costs of conventional devices resulting from the complications associated with incorporation damping material.