Encapsulated pressure sensing semiconducting device - contains sensor element with membrane in resin capsule with section removed to form membrane access window

摘要

The sensor arrangement contains a pressure sensor element (50) with a membrane (5) and a shape-hardened capsule to seal the element. The capsule has a window giving access to the membrane. The press. sensor element contains a pyrex block (1) and a pressure sensing chip (2) attached to the block. The capsule can be made of epoxy resin (11). Manufacture involves producing the sensor element with membrane, completely covering with resin and removing resin from above the membrane to form the window. ADVANTAGE - The arrangement cab be economically manufactured and operates reliably under adverse external conditions.