发明名称 Epoxy resin composition.
摘要 <p>A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.</p>
申请公布号 EP0418888(A2) 申请公布日期 1991.03.27
申请号 EP19900118120 申请日期 1990.09.20
申请人 DOW CORNING TORAY SILICONE COMPANY, LIMITED 发明人 ENAMI, HIROJI;IMAI, TAKESHI
分类号 C08K5/5435;C08L63/00;C08G59/00;C08G59/62;C08K5/544;C08K5/549;C08K13/02;H01L23/29;H01L23/31 主分类号 C08K5/5435
代理机构 代理人
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