发明名称 |
Epoxy resin composition. |
摘要 |
<p>A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.</p> |
申请公布号 |
EP0418888(A2) |
申请公布日期 |
1991.03.27 |
申请号 |
EP19900118120 |
申请日期 |
1990.09.20 |
申请人 |
DOW CORNING TORAY SILICONE COMPANY, LIMITED |
发明人 |
ENAMI, HIROJI;IMAI, TAKESHI |
分类号 |
C08K5/5435;C08L63/00;C08G59/00;C08G59/62;C08K5/544;C08K5/549;C08K13/02;H01L23/29;H01L23/31 |
主分类号 |
C08K5/5435 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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