| 摘要 |
<p>PURPOSE:To reduce an occupied space on a plane, eliminate atmospheric temperature difference between a semiconductor sensor package and a hybrid IC part, maintain a high-accuracy characteristic and facilitate the assembling of the hybrid IC to a circuit substrate. CONSTITUTION:A guide body 24 is fixed to a circuit substrate 10 by a locking means in such a state as to surround the side periphery of a semiconductor sensor package 11 on the circuit substrate 10. Each lead 23 of a hybrid IC 20 with an IC part 22 mounted to the lower face of a distributing board 21 and brought near above the sensor package 11 is passed through the guide hole 24d of the guide body 24 through the inclined lead-in part 24e of an inlet and inserted into the through hole 10b of the circuit substrate 10.</p> |
