| 摘要 |
The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to a real-time feedback circuit. The feedback circuit transmits a force adjustment signal to a z-motion actuator to adjust the force applied to the bond site.
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