| 摘要 |
<p>PURPOSE:To prepare the title compsn. excellent in adhesion to a copper foil, resistance to soldering heat, and electrical properties such as insulation resistance and stability of resistance and esp. suitable for an ultraviolet- or heat- curable solder resist ink. CONSTITUTION:The title compsn. is prepd. by compounding a resin compsn. at least contg. an epoxy resin having at least two epoxy groups in the molecule, a vinyl monomer having an ethylenically unsatd. double bond, and a cationic- polymn. catalyst with a carboxylated polymer which is solid at room temp. and has an acid value of 150 or higher.</p> |
