| 摘要 |
PURPOSE:To prevent erecting of a chip even if very small chip parts, such as 1005 are soldered. CONSTITUTION:This cream solder is prepd. by mixing powder solder consisting of 1.5 to 7wt.% Ag and the balance Sn and powder solder consisting of 80 to 100wt.% Pb and the balance Sn in such a manner as to contain 1 to 4wt.% Ag, 50 to 65% Sn and the balance Pb after melting. |
