发明名称 METHOD FOR RESIN MOLDING OF LEAD FRAME AND MOLD FOR MOLDING
摘要 PURPOSE:To solve a problem when a cured resin such as a runner is peeled off and removed from a lead frame and to solve a problem wherein an unnecessary resin remains on the lead frame and falls in a mold during conveying to damage the mold. CONSTITUTION:When a resin is molded by extending a resin path in the width direction on a lead frame 10 from one side edge of the lead frame, a necking part for forming a V-notch part 30 on a cured resin cured in a runner path, is provided in the runner path in the neighborhood of the side edge of the lead frame and the resin is transferred. At the same time, after the resin is cured, the V-notch part 30 is bent as a bent position between a cull 12 and the cured resin 16 cured in the runner path to separate and remove the cull 12 from the lead frame 10 while the resins 16 and 18 cured in the resin path such as the runner path are adhered on the lead frame 10.
申请公布号 JPH05185457(A) 申请公布日期 1993.07.27
申请号 JP19920020596 申请日期 1992.01.08
申请人 APITSUKU YAMADA KK 发明人 OTSUBO YASUSHI
分类号 B29C45/02;B29C45/26;B29C45/27;B29L31/34;H01L21/56 主分类号 B29C45/02
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