| 摘要 |
PURPOSE:To provide a device and a method for soldering, in which warp of a printed board at the time of soldering is prevented and the stable soldering condition can always be kept. CONSTITUTION:By providing this soldering device 100 composed of a solder vessel 20, a jet soldering device 10 for forming the jet soldering waveform surface 11 and a printed board supporting sprocket 1 positioned above the jet soldering nozzle 21 and intermittently brought into contact with and supported to the printed board 40 with the rotation and the shift, the warp of the printed board is prevented and the stable soldering condition is always kept, and the soldering yield and the productivity are improved, and the quality of the printed board is stabilized. |
