| 摘要 |
<p>PURPOSE:To make it possible to directly connect mutual packages of a semiconductor integrated circuit and reduce the occurrence of noise and the delay of signal propagation caused by passing through wiring on circuit substrate. CONSTITUTION:A protrusion 6 tend an electrode terminal 2a are installed on one opposed side other than the side on which an outer lead 4 of a package body 1 on which an IC chip 3 is mounted is disposed, and a recess 7 and an electrode terminal 2b are installed on the other side. By this, mutual packages can be connected, and a signal between semiconductor integrated circuits can be received and sent without passing through wiring of a circuit substrate and then reduction of noise and prevention of signal delay can be implemented.</p> |
