发明名称 ASSEMBLY OF BAGGING FILM AND SEAL MATERIAL FOR HIGH TEMPERATURE MOLDING OF THERMOPLASTIC RESIN COMPOSITE MATERIAL AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To remarkably improve the workability of bagging by performing adhesion of a seal material under pressure by providing energy in an assembly prepd. by adhering a bagging film for high temp. molding for a thermoplastic resin composite with the seal material. CONSTITUTION:In an assembly 1 wherein the outer edge part of a heat-resistant bagging film 2 is adhered with a seal material 3 and the outer surface of the seal material 3 is covered with a releasable seal 4, when a heat-resistant seal material 3 which exhibits weak adhesiveness at room temp. and is hardly adhered with the bagging film 2 for high temp. molding, good adhesion is made possible by providing energy under the condition wherein both parts 2 and 3 are brought into contact with each other and under pressure. As the device for providing energy, a heating device based on heat transfer, impulse, high frequency, ultrasonic, electromagnetic induction, infrared etc., is used and an ultrasonic welding device is preferably used. Leakage hardly occurs thereby at bagging and workability for bagging is improved.</p>
申请公布号 JPH05185448(A) 申请公布日期 1993.07.27
申请号 JP19920021960 申请日期 1992.01.10
申请人 HONDA MOTOR CO LTD 发明人 IGUCHI MASARU;MATSUMOTO KEIZO;SHIGETA HIROMASA
分类号 B29C43/32;B29C65/02;B29K105/06;B32B7/10;B32B27/06;B32B37/10 主分类号 B29C43/32
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