发明名称 FRP BOARD HEATING PLATE
摘要 PURPOSE:To obtain a large FRP board heating plate generating no warping by providing an insulating layer on the surface of a conductive layer avoiding an electrode and a connection of the electrode to the outer side. CONSTITUTION:An FRP board plate 1 is provided with a conductive layer 2. On the surface of the conductive layer 2, an insulating layer 4 is provided avoiding an electrode 3 and its connection to the outer side. The FRP is so- called fiber reinforced plastics, and a heat resisting fiber such as a glass fiber, a carbon fiber, and a polyimide is used as its fiber. A heat resisting resin such as a thermosetting resin and the polyimide is used as its resin component.
申请公布号 JPH05182749(A) 申请公布日期 1993.07.23
申请号 JP19910357575 申请日期 1991.12.26
申请人 SHOWA SHELL SEKIYU KK 发明人 SHIOZAWA MASATATSU;SATO MASAO
分类号 A01K1/02;E04C2/52;F24D13/02;H05B3/20 主分类号 A01K1/02
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