WAFER COOLING SYSTEM

摘要

PURPOSE:To provide the title wafer cooling system capable of efficiently forced- cooling semiconductor wafers without lowering the vacuum degree in a vacuum chamber of a dry-etching device. CONSTITUTION:The title wafer cooling system to cool down a wafer (1) mounted on the surface of a stage (2) equipped with cooling means (4) almost horizontally arranged in h vacuum chamber of a dry-etching device of the wafer (1) is composed of a sealing member (5) arranged in a ring shape on the surface periphery of the stage (3), a gas feed port (6) and a gas exhaust port (7) formed in the central part encircled by the sealing member (5) on the stage surface as well as a gas feed and exhaust control part (8) feeding helium gas (9) from the gas feed port (6) to a fine gap (G) encircled by the stage (3), the sealing member (5) and the wafer (1) while exhausting the over-fed helium gas (9) from the exhaust port (7) so as to fluidally fill up the gap (G) with the helium gas (9).