LEAD FRAME AND SEMICONDUCTOR DFVICE

摘要

PURPOSE:To provide a lead frame and a semiconductor device using therein capable of preferably improving electrical properties to high-speed signal. CONSTITUTION:A resistor 16 is formed on a being face of the top of an inner lead 10. An electrical insulator 14 is formed on the bonding face of the top of the inner lead 10 and then the resistor 16 can be formed on the electrical insulator 14.