发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To provide a photosensitive resin compsn. capable of forming a uniform coating film having high sensitivity by incorporating a specified precursor of poly(amido)imide, specified acrylamidoglycolic acids and a photopolymn. initiator. CONSTITUTION:This photosensitive resin compsn. contains a precursor of poly(amido)imide contg. repeating units represented by formula I, acrylamidoglycolic acids represented by formula II and a photopolymn. initiator and/or a sensitizer. In the formula I, R<1> is a tri- or tetravalent org. group and R<2> is a divalent org. group. In the formula II, each of R<3> and R<4> is H, methyl or ethyl. The precursor of poly(amido)imide can be produced by bringing tetracarboxylic acid dianhydride, tricarboxylic acid anhydride or a deriv. thereof and diamine into a reaction in a solvent.
申请公布号 JPH05181275(A) 申请公布日期 1993.07.23
申请号 JP19910359469 申请日期 1991.12.27
申请人 CHISSO CORP 发明人 KUNIMUNE KOICHI;MAEDA HIROTOSHI;WATANABE EIJI
分类号 G03F7/027;G03F7/031;G03F7/038;H01L21/027 主分类号 G03F7/027
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