发明名称 METHOD AND APPARATUS FOR SOLDERING INSPECTION
摘要 PURPOSE:To enable the implementing of inspecting both of a bridge and a hole in the same process along a higher bridge detection accuracy by using a light source to irradiate the surface of a solder with light from a specified direction and a light source for irradiation from a plurality of directions separately. CONSTITUTION:The surface S of a solder of a substrate 10 is irradiated with a first light source L1 and an XY table 4 is moved by a control means F3 to trace soldered parts of the substrate 10. As the light source L1 makes an irradiation from a point in proximity to a camera means F1, much of the light hitting the soldered parts and a bridge being bulged is reflected sideways in the direction of irradiation. Therefore, when the light is caught by the means F1 the parts are recognized as shadows to allow the discrimination between absence and presence of the bridge accurately by a discrimination means F2. Then, the solder surface of the substrate 10 is irradiated with light from the second light source L2 to trace the soldered parts. The light source L2 comprising a plurality of luminous bodies 2 irradiates the solder surface from multiple directions and when the lights caught by the means F1, holes alone are recognized as shadow parts thereby enabling the means F2 to identify the holes.
申请公布号 JPH05180779(A) 申请公布日期 1993.07.23
申请号 JP19910315054 申请日期 1991.11.28
申请人 KOMATSU GIKEN KK 发明人 TSUCHIDA AKIO
分类号 G01B11/24;G01N21/84;G01N21/88;G01N21/93;G01N21/956;G06T1/00;H05K3/34 主分类号 G01B11/24
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