| 摘要 |
PURPOSE:To miniaturize a device by pulling out the lead of a terminal block from the side surface of the terminal block and bending the tip end part of this lead along the side wall of the terminal block for making it possible to perform brazing in a reflow tank without fixing the terminal block to a printed wiring board by using some jig or the like. CONSTITUTION:A terminal block 2 is composed of a terminal screw 3 for fixing a wiring connected from the outside, a fixed terminal 5 having a screw hole for making threaded engagement with the terminal screw 3 and a molded body 4 containing the fixed terminal 5 and forming the terminal block 2. The fixed terminal 5 has a lead pin 6 which is extending outward from the side wall of the terminal block 2, and this lead pin 6 has its front end part bent along the side wall at the preset point, which is apart from the side wall. The end part is inserted into a hole formed in a printed wiring board 1 and attached as the side surface of the printed wiring board 1 and the side wall of the main body of the terminal block 2 are facing with each other. In this way, the terminal block 2 can be soldered to the printed wiring board 1 in a reflow tank without using any fixing member or the like. |
