| 摘要 |
PURPOSE:To obtain an alignment mechanism which can simultaneously expose both faces by a method wherein a state after an positioning operation is sucked, held and fixed to an alignment state. CONSTITUTION:A wafer is placed on a lower mask 2 from a previous process; it is held in its position from the right and the left by using a wafer clamper; an upper mask 1 is lowered to a prescribed height. An upper-part mask substrate 16 is positioned in the Z-direction while a fulcrum 17 is brought into contact with a reference point 14; a direction-setting protrusion part 15 is fitted to a fitting recessed part 18; the substrate is positioned in the X-Y direction. The substrate is sucked and fixed by using a suction means 21; it is set to a completely positioned state; a treatment process which is composed of an oxidation operation, a resist-film coating operation, a prebaking operation, an exposure operation, a development operation, a postbaking operation, an etching operation, a vapor growth operation and an impurity diffusion operation is made to progress; a primary exposure operation, a secondary exposure operation and a tertiary exposure operation are repeated. Consequently, it is possible to realize an alignment mechanism which can expose both faces simultaneously, which enhances a so-called throughput by smoothly performing the exposure operation and which can rationalize a semiconductor manufacturing process. |
