发明名称 WIRING BOARD AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To obtain a wiring board which is capable of large current supply and can easily be manufactured at a low cost. CONSTITUTION:A power feeding layer 30 is constituted of a power supply layer 301 and an earth layer 302 composed of conductive plates like a copper plate, an iron nickel plate, and an aluminum plate, and an insulating member 303 which is formed between the above layers and composed of epoxy resin, polyimide resin, etc. A through hole 301a is formed in the power supply layer 301. A protruding part 302a is formed on the surface of the earth layer 302 and inserted into the through hole 301a in the power supply layer 301 via an insulating member 303. The power supply layer 301 and the earth layer 302 are electrically connected with a viahole 107 and a viahole 108 formed in a signal wiring layer 10, respectively.</p>
申请公布号 JPH05183271(A) 申请公布日期 1993.07.23
申请号 JP19920000784 申请日期 1992.01.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 OBARA MASANOBU;HAMAGUCHI TSUNEO
分类号 H01L23/12;H05K1/00;H05K1/02;H05K3/46 主分类号 H01L23/12
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