| 摘要 |
<p>The invention relates to a soldering device comprising: a vessel (1) opened at the top for filling with solder; at least two solder towers (5, 6) placed in the vessel, each adapted for delivering a flow (8, 12) of solder on their upper side; and a transporting member (3) for carrying along the objects for soldering above the solder towers. In order to prevent, both in the case of soldering machines which operate in a normal atmosphere and those operating in an inert atmosphere, the solder flows falling back into the vessel forming splashes which collide with the underside of the printed circuit boards, the solder towers are adapted for generating jets directed toward each other, wherein the jets intersect before they make contact with the solder level prevalent in the vessel. According to a preferred embodiment the rear tower (6) in the direction of movement forms a jet of solder comprising a movement component counter to the movement of the objects for soldering and enclosing an acute angle with the object for soldering.</p> |
