摘要 |
The following polyimide resin compositions (A) and (B) and processes for their production are disclosed. A: A polyimide resin composition which comprises a solution in an organic solvent of at least one polyimide having repeating units represented by general formula (I) (wherein Z represents -S-, (a), (b) or (c), wherein X represents -O-, -S- or (d), and Y represents a single bond or a divalent group selected from among -O-, -S-, -SO2-, (e) and -CO-, and R<1> and R<2>, which may be the same or different, each represents a hydrogen atom, a halogen atom or an optionally halogen-substituted lower alkyl group) and having an intrinsic viscosity of about 0.3 to 5.0 dl/g. B: A polyamide resin composition prepared by adding a silane coupling agent to the resin composition A. |
申请人 |
IKEDA, TSUYOSHI;NAKAZAWA, MIKIO;MANAMI, HIROSHI;KAWASHIMA, YUJI |
发明人 |
IKEDA, TSUYOSHI;NAKAZAWA, MIKIO;MANAMI, HIROSHI;KAWASHIMA, YUJI |