| 摘要 |
PURPOSE:To reduce the number of components in an assembly process by two, by encapsulating at least one semiconductor bare or flip chip directly mounted on the upper surface of a laminated ceramic capacitor, and by disposing a printed resistor on the bottom surface of the capacitor. CONSTITUTION:The thick lines in the cross section, and along the periphery, of a laminated capacitor 10 designate capacitor electrodes and interconnection conductors. Side sections 16 of the capacitor represent a connecting electrode for connecting a connection line of a capacitor electrode of each of stacked layers with an external circuit. At least one semiconductor bare or flip chip 14 is directly mounted on the upper surface of the laminated ceramic capacitor 10, and the chip is encapsulated. A printed resistor 13 is disposed on the bottom surface of the capacitor. Thereby, a surface mount electronic function circuit device has a significant effect on the reduction of size and costs. |
