发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the structure of connection between an internal circuit and Vcc power supply wiring and reference power supply wiring which are alternatively connected thereto. CONSTITUTION:An end of Vcc power supply wiring 5a and that of reference power supply wiring 5b are located in proximity to the input terminal of an internal circuit 2. The input terminal of the internal circuit is connected to either of the Vcc power supply wiring and the reference power supply wiring according to the specifications for the semiconductor device. The connection is formed using a bonding wire when lead frames 7 and 8 are connected to bonding pads 1a and 1b with the same bonding wire.
申请公布号 JPH05183055(A) 申请公布日期 1993.07.23
申请号 JP19920000307 申请日期 1992.01.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 KUBO KENJI
分类号 H01L21/82;H01L21/822;H01L23/482;H01L23/525;H01L23/538;H01L27/04 主分类号 H01L21/82
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