| 摘要 |
<p>A curable or polymerizable epoxy resin based composition characterized in that its curing system combines synergistic amounts of (i) at least one imidazole which, on its own, is able to cause the polymerization of epoxy resin only at a temperature higher than about 75 °C; and (ii) at least one polyamine compound which, on its own, enables epoxy resin polymerization at a temperature lower than about 75 °C. Said resin is particularly suitable for manufacturing composite structures which may be used in shipbuilding in particular.</p> |
