| 摘要 |
<p>A probing apparatus including probes contacting with electrode pads of the semiconductor wafer for measuring a semiconductor wafer in which a probe card is safely and individually installed and a wafer testing system in which a plurality of probe cards are efficiently used are disclosed. A probing apparatus includes moving means 4 for receiving a card holder 2 accommodating a probe card 1, moving the card holder 2 into a position just below a pogo pin socket 3 to which the probe card 1 is attached, and lifting the card holder 2, and attaching means 5 for attaching the probe card 1 to the pogo pin socket 3. <IMAGE></p> |
