摘要 |
Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another. <IMAGE> |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAYSON, BURTRAN JOE;COVERT, JOHN ARTHUR;DUNCAN, STEVEN ALLEN;LAUFFER, JOHN MATTHEW;MAHMOUD, ISSA SAID;SCHUMACHER, RICHARD ANTHONY |