发明名称 |
Apparatus and method for electroplating wafers |
摘要 |
An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.
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申请公布号 |
US5228967(A) |
申请公布日期 |
1993.07.20 |
申请号 |
US19920871854 |
申请日期 |
1992.04.21 |
申请人 |
ITT CORPORATION |
发明人 |
CRITES, JAMES W.;COULSON, J. MEADE |
分类号 |
C25D7/12;C25D17/00;H01L21/00;H01L21/673 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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