Solder nozzle with gas knife jet

摘要

A solder nozzle to produce a smooth turbulent free solder wave has at least one air jet associated therewith to remove solder icicles and bridges that can form on the under surface of circuit boards and other elements. The circuit boards move in an upward inclined path in the direction of travel and after passing through the solder wave an air knife projects a non-oxidizing gas with sufficient force to remove excess solder. The soldering can occur in a non-oxidizing gas enclosure such as an inert gas, or a reducing gas, and vibrating the solder wave below ultrasonic frequencies can assist in the soldering.