ELECTRONIC COMPONENT MOUNTING DEVICE FOR

摘要

PURPOSE:To correct misregistration by thermal expansion and to improve mount accuracy of a component to a substrate by detecting a misregistration amount of a substrate movement means and a component attraction means due to thermal expansion by a misregistration amount detection means and by mounting a component at a substrate position by correcting the misregistration amount. CONSTITUTION:An electronic component mounting device is provided with an X-Y table 10 with a recognition mark 11. A substrate recognition camera 32 for recognizing misrefistration of a position of a substrate mounted on the X-Y table 10 is arranged. Detection result from a temperature detector 35 for detecting temperature change of a heat generator such as a motor 20 is supplied to a control device 34. Position correction of an attraction nozzle 31 to a component recognition camera 30 is carried out by acquiring misregistration of a center of the attraction nozzle 31 to the component recognition camera 30. For example, misregistration of the attraction nozzle 31 and a ball screw 21, and a distance correction between the substrate recognition camera 32 and the attraction nozzle 31 are carried out.