| 摘要 |
PURPOSE:To provide the electronic ray-curable adhesive comprising a polyester resin and a polyester oligomer and/or a polyurethane oligomer each having polymerizable unsaturated double bonds and suitable for bonding polyester films to metal raw materials. CONSTITUTION:An electronic curable adhesive comprises (A) 100 pts.wt. of a polyester resin having a number-average mol.wt. of 7000-40000, preferably 10000-30000, and (B) 2-200 pts.wt. (solid content), preferably 5-100 pts.wt., of a polyester oligomer and/or a polyurethane oligomer each having a number- average mol.wt. of 300-5000, preferably 1000-2000, and having polymerizable double bonds of 0.3-5moles/kg of the molecule, preferably 1-3moles/kg of the molecule, e.g. a OH group-containing low mol.wt. polyester ester-bonded with (meth)acrylic acid, the components being dissolved in an organic solvent. A metal raw material is bonded to a polyester film with the adhesive, and subsequently the adhesive is cured with electronic rays to provide a polyester film- bonded metal plate. |
