发明名称 |
Physical vapor deposition clamping mechanism and heater/cooler |
摘要 |
A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.
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申请公布号 |
US5228501(A) |
申请公布日期 |
1993.07.20 |
申请号 |
US19920939542 |
申请日期 |
1992.09.02 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TEPMAN, AVI;GRUNES, HOWARD;ANDREWS, DANA |
分类号 |
C23C14/50;H01J37/32;H01L21/00;H01L21/687 |
主分类号 |
C23C14/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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