发明名称 Physical vapor deposition clamping mechanism and heater/cooler
摘要 A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.
申请公布号 US5228501(A) 申请公布日期 1993.07.20
申请号 US19920939542 申请日期 1992.09.02
申请人 APPLIED MATERIALS, INC. 发明人 TEPMAN, AVI;GRUNES, HOWARD;ANDREWS, DANA
分类号 C23C14/50;H01J37/32;H01L21/00;H01L21/687 主分类号 C23C14/50
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