发明名称 |
Ceramic circuit board and a method of manufacturing the ceramic circuit board |
摘要 |
A ceramic electrically insulating circuit board (1) has an electrically conductive plug (4a) tightly filling a through-hole (2) formed in the circuit board (1) made of aluminum nitride including a low, up to 1% by weight at the most, content of an oxide phase as a sintering assistant. The conductive plug is formed by putting high melting point metal paste (10) into the through-hole and sintering either the board prior to the metal paste or sintering both, the board and the paste, simultaneously. Then, causing melted copper or copper alloy (11) to permeate into gaps or interstices in the sintered high-melting point metal plug to form a tight seal of the hole and good electrical contacts of the conductive plug and any circuits on both sides of the board.
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申请公布号 |
US5229549(A) |
申请公布日期 |
1993.07.20 |
申请号 |
US19910753928 |
申请日期 |
1991.09.03 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YAMAKAWA, AKIRA;OSADA, MITSUO;OGASA, NOBUO |
分类号 |
H01L21/48;H05K1/03;H05K1/09;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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