发明名称 |
HIGH-DENSITY MEMORY ARRAY PACKAGING |
摘要 |
A low-profile, high-density package for integrated circuit chips (18) is provided. A first multichip memory module (20) includes first and second interconnect members having low-profile memory chips (24) mounted on a first side of each member. Low-profile edge clips are employed to mechanically connect a second side of the second member to a second side of the first member, and to electrically connect the first sides of the members to a first surface of a circuit board (15). Likewise, a second multichip memory module (21) includes first and second interconnect members having low-profile memory chips (27) mounted to a first side of each member. Low-profile edge clips are employed to mechanically connect the second sides of the members, and to electrically connect the first sides of the members to a second surface of the circuit board. A thermal management technique that distributes thermal loads is thereafter applied to create a high-density package capable of insertion into a standard computer blackplane (10) and cabinet. <IMAGE> |
申请公布号 |
CA2031865(A1) |
申请公布日期 |
1993.07.20 |
申请号 |
CA19902031865 |
申请日期 |
1990.12.10 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
WU, ANDREW L.;SMELSER, DONALD W.;BRUCE, E. WILLIAM, II;O'DEA, JOHN |
分类号 |
H01L23/538;H01L25/00;H01L25/04;H01L25/065;H01L25/10;H01L25/16;H01L25/18;H05K1/14;H05K3/34 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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