SPECULAR POLISHING METHOD FOR CDTE WAFER

摘要

PURPOSE:To provide a specular polishing method for a CdTe wafer, which is equal to the conventional process about scratch and damage layer and which gives a specular surface having a surface roughness lower than the level according to the conventional process. CONSTITUTION:Mechanical polishing is made by the use of a polishing solution 6 containing abrasive grains and a polishing cloth 2, and as final process, a chemical polishing is conducted for a short time using a polishing solution of chemical type and a hard polishing cloth. These processes constitute a specular polishing method for a CdTe wafer.