| 摘要 |
PURPOSE:To realize compacting, and also carry out receipt/delivery of a plate like body at high speed in a treating device provided with a treating station and a receipt/delivery station of the plate like body. CONSTITUTION:A intermediate receipt/delivery stand 4 to serve also as a cooling mechanism is arranged so as to face a receiving and delivery port of an applying/developing station S1 for a semiconductor wafer, on the one hand, a receipt/delivery use conveying mechanism 5 provided with a freely advancing/ retreating pincette 6 is constituted so as to be rotatable freely as well as to pass through a lower position of the intermediate receipt/delivery stand 4, and a wafer centering positioning mechanism 65 is combined with the conveying mechanism 5. A receiving/loading stand 71 and a delivery/loading stand 72 are also arranged in a delivery station S2 so as to fix the positions, and buffer carriers C are arranged on both sides of a conveying passage. In the case where a main conveying passage is divided in the treating station S1, a receipt/delivery standby section is arranged on the uppermost stage of a treating section between main conveying arms 3. |
