发明名称 Method and apparatus for fabricating superconducting wire
摘要 A superconducting wire which includes a base wire and at least a superconduction layer formed on the base wire. The superconduction layer may be formed by using a sputtering system for depositing a film of high temperature superconductor material on the base wire. The superconducting wire may further include an adhesion layer, a diffusion barrier layer and/or a protection layer. Several superconducting wires may be grouped together in a metal matrix to form a composite superconducting wire.
申请公布号 US5229358(A) 申请公布日期 1993.07.20
申请号 US19900621390 申请日期 1990.12.03
申请人 MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION 发明人 KUMAR, NALIN
分类号 C23C14/34;C23C14/56;H01J37/34;H01L39/24 主分类号 C23C14/34
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