发明名称 |
Method and apparatus for fabricating superconducting wire |
摘要 |
A superconducting wire which includes a base wire and at least a superconduction layer formed on the base wire. The superconduction layer may be formed by using a sputtering system for depositing a film of high temperature superconductor material on the base wire. The superconducting wire may further include an adhesion layer, a diffusion barrier layer and/or a protection layer. Several superconducting wires may be grouped together in a metal matrix to form a composite superconducting wire.
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申请公布号 |
US5229358(A) |
申请公布日期 |
1993.07.20 |
申请号 |
US19900621390 |
申请日期 |
1990.12.03 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
KUMAR, NALIN |
分类号 |
C23C14/34;C23C14/56;H01J37/34;H01L39/24 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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