| 摘要 |
PURPOSE:To improve the transfer of generated heat to a package sealed up with resin, by shaping the cross section of a tab hanger lead constituting a lead frame and the cross section of a lead on a part sealed up with resin, as U or V to increase the effective cross-sectional area. CONSTITUTION:A lead frame is composed of a tab 10 whereon a semiconductor pellet 16 is mounted, a tab hanger lead 8, an electrode lead 9, etc. The lead 9 is connected through a coupling wire 15 to the pad 14 of the pellet 16 secured on the tab 10 and is sealed up with resin to manufacture an electronic device to make a package. Flat flanges 13 are provided on the top of each of the leads 8, 9. The cross section of each lead is shaped as U or V. The tab 10 and the bottom of each lead are located at the same height. The flanges 13 are located higher than the tab 10. As a result, heat from the pellet 16 is efficiently transferred to the package and the wires 15 are located so high that a short circuit or the like does not occur. |
