| 摘要 |
PURPOSE:To make a coated film which is excellent in resistance to humidity and cracking, by coating a fluorine fluoroplastics resin on a semiconductor chip and packing them up with a thermosetting resin. CONSTITUTION:An ethylene fluoride resin is finely pulverized into a grain size of 50mum or less. An Si resin is prepared as a binder. Both the resins are mixed with an organic solvent so that the ratio of the former resin to the latter resin is 2:8-8:2. The mixture is dropped onto a chip already wired. The dropped mixture is baked on the chip at about 800 deg.C. The chip and the baked mixture are then entirely sealed up with a tehrmosetting Si resin. Since some of the finely pulverized fluorine resin contained in the mixture is partly melted by the heating at about 800 deg.C and bake- bonded by the binder, the chip and the coated film are bonded well to each other at a comparatively low temperature. The water repellency and softness of the bake- bonded film are maintained by the fluoroplastics contained in the film. Therefore, the film has high resistance to humidity and cracking and electric properties are not deteriorated. |
